While the announcement doesn't specify the chipset's name, it's widely anticipated to be the Dimensity 9300.
This chipset is expected to succeed the Dimensity 9200 SoC from the previous year and bring several upgrades to the table.
A previous leak indicated that the chipset could reach a maximum clock speed of 3.5GHz, surpassing the Snapdragon 8 Gen 3 chipset's 3.3GHz clock speed.
MediaTek's offering is rumored to feature a '1+3+4' CPU structure, consisting of one ARM Cortex X4 Prime core, three ARM Cortex X4 cores, and four ARM Cortex A720 cores.
For comparison, the Snapdragon 8 Gen 3 adopts a '1+(3+2)+2' structure, which includes a Cortex-X4 prime core, three Cortex-A720 cores, two Cortex-A720 cores, and two Cortex-A520 cores.
While the Dimensity 9300 may boast more X4 cores compared to the Snapdragon Gen 3, it raises questions about potential thermal management and throttling. Details on the chipset's thermal characteristics, camera capabilities, and more are still awaited.
However, the inclusion of the Immortalis G720 MC12 GPU is expected. Additionally, the MediaTek Dimensity 9300 chipset might be based on the 4nm process, similar to the Snapdragon 8 Gen 3.
It remains to be seen how the Dimensity 9300 will stack up against Qualcomm's offering.
While it recently secured a notably high AnTuTu score, the real-world performance is yet to be determined.
As we await further concrete details, feel free to share your thoughts on this development in the comments. We'll keep you updated with all the official information as it unfolds.